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Semron raises $7.9M for AI chips with 3D packaging

Jan 30, 2024almost 2 years ago

Amount Raised

$7.9 Million

DresdenSemiconductor Manufacturing

Investors

Onsight VenturesOtb VenturesSquare OneJoin Capital

Description

Semron has raised $7.9 million (7.3 million euros) for AI chips with 3D packaging for mobile devices. The funding round was led by Join Capital and supported by SquareOne, OTB Ventures, and Onsight Ventures, positioning Semron for semiconductor innovation. With the fresh capital infusion, Semron plans to intensify hardware and compiler development, expand its team, and focus on internationalization.

Company Information

Company

Semron

Location

Dresden, Saxony, Germany

About

THE ai CHIP WITH THE HIGHEST INTELLIGENCE DENSITY

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Funding Insights

Based on industry data
VC-backed spending patterns
VC-backed companies spend 89% more on sales and 100% more on marketing than bootstrapped peers