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Hi Link Inc. announced it raised $75,000 in an initial filing from an offering of $750,000

Oct 21, 2021over 3 years ago

Amount Raised

$75,000

Round Type

pre-seed

ChicagoInformation Technology

Company Information

Company

HiLink Inc.

Location

401 N MICHIGAN AVE

Chicago, Illinois, United States

Funding Insights

Based on industry data
Tech investment trends
83% of B2B companies plan digital investments, with 79% prioritizing customer experience tech

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