Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter.

https://eliyan.com/

Santa Clara County, California, United States

Eliyan Closes $40M Series A Funding Round And Unveils Industry's Highest Performance Chiplet Interconnect Technologies

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Eliyan Closes $40M Series A Funding Round And Unveils Industry's Highest Performance Chiplet Interconnect Technologies

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