Bondingai announced it raised $100,000 in an initial filing from an offering of $750,000
Bondingai announced it raised $100,000 in an initial filing from an offering of $750,000
05/15/25, 5:05 PM
Location
issaquah
Money raised
$100,000
Industry
information technology
Round Type
pre-seed
Company Info
Company
BondingAI
Location
2428 35th avenue ne
issaquah, washington, united states
Additional Info
BondingAI is the only platform that offers a scalable, all-in-one solution, enabling enterprises to create their own LLM to drive transformation at scale without the need for fragmented tools.
issaquah