Goldstone, Ciif Co-Lead $392M Series C Funding In Chinese Aiot Chip Maker Eswin
12/06/21, 12:46 AM
Location
beijingMoney raised
$392 million
Round Type
series c
Beijing ESWIN Technology Group, a Chinese provider of artificial intelligence of things (AIoT) chips and services, has pocketed 2.5 billion yuan ($392.4 million) in a Series C round of financing to step up R&D investment and talent recruitment.
Company Info
Location
beijing, beijing, china
Additional Info
The firm delivers display, smart connectivity, AIoT, and smart processing acceleration IC solutions to industries including mobile devices, smart home, smart transportation, and industrial Internet of Things (IoT). Earlier, the firm had raised a Series A round from IDG Capital, Triniti Capital, Broad Vision Funds, and Beijing Singularity Power Investment Fund in January 2019, shows its official website.