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Goldstone, Ciif Co-Lead $392M Series C Funding In Chinese Aiot Chip Maker Eswin

Dec 06, 2021•over 3 years ago

Amount Raised

$392 Million

Round Type

series c

Beijing

Description

Beijing ESWIN Technology Group, a Chinese provider of artificial intelligence of things (AIoT) chips and services, has pocketed 2.5 billion yuan ($392.4 million) in a Series C round of financing to step up R&D investment and talent recruitment.

Company Information

Company

Beijing Eswin Technology Group

Location

Beijing, Beijing, China

About

The firm delivers display, smart connectivity, AIoT, and smart processing acceleration IC solutions to industries including mobile devices, smart home, smart transportation, and industrial Internet of Things (IoT). Earlier, the firm had raised a Series A round from IDG Capital, Triniti Capital, Broad Vision Funds, and Beijing Singularity Power Investment Fund in January 2019, shows its official website.

Funding Insights

Based on industry data
Tech investment trends
83% of B2B companies plan digital investments, with 79% prioritizing customer experience tech