Koh Young has announced its partnership with NTV USA to bring its proven inspection technologies to the semiconductor industry in the United States. Through this collaboration, Koh Young will make its metrology and inspection technology available to companies in the U.S. engaged in advanced packaging applications such as System-in-Package (SiP), Wafer-Level Packaging (WLP), die stacking, and more.

Koh Young is the global leader in True 3D measurement-based inspection and metrology solutions with a reputation for innovation, accuracy, and reliability in the Surface Mount Technology (SMT) sector.

https://kohyoung.com/

Koh Young Partners with NTV USA for Semiconductor Inspection Solutions in the United States

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Koh Young Partners with NTV USA for Semiconductor Inspection Solutions in the United States

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